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06 Mar 2007 - Freescale Redistributed Chip Packaging technology moves toward volume production
AUSTIN, Texas - March 6, 2007 - Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications. Details... more...
Intel to sample phase change memory in 1H 2007
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more...
Intel to sample phase change memory, successor to flash
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more...